When is a bad board not a bad board?

A PCB can be failed for many reasons, not all of which constitute a true functional fail. Board registration, imperfections in the solder mask, a high contact surface resistance … These and many other issues can result in an incorrect “fail”, and a perfectly good board being treated as bad product.

Test Floor Integration

Gardien helps to increase your yields and guard against unnecessary losses with a specially designed Test Floor Integration (TFI) process. This Verification – Identification – Repair procedure analyzes exactly what can be done with any failed boards, increasing your yields and reducing your costs, significantly.

Before consigning a failed board to waste, Gardien puts it through the Test Floor Integration (TFI) process, offering you:

  • Higher yields
  • Lower costs
  • Rapid fault verification and identification
  • Unprecedented repair opportunities
  • Quality improvements through data feedback
  • Compliance with IPC-9252 Class 3 & Class 3A and most military specifications

The TFI Process

Conducted by a Flying Probe this full resistive test automatically verifies all faults contained in the data log file created during grid testing.

Automatic board selection

The failed board is selected automatically using a bar code that associates it with the grid tester’s data log.

Cross checks

The PCB’s bar code is scanned and verified against the defects reported in the data log to ensure that the right board is under test.

Rapid fault verification

Once the product has been verified as faulty, it is taken to the Visual Fault Diagnostics Station where the bar code from the Flying Probe is scanned and defect locations are automatically loaded and displayed. In this way, true faults are verified and located much more rapidly and reliably than they can be using more conventional approaches.

Fault report generation

Where a true fault is identified, its position, and where possible, its cause, are reported and fed back into the manufacturing process improvement procedure.

Repair data generation

Where repair is an option, Gardien’s Visual Fault Diagnostics Aided Repair (GVFDAR) makes it possible to track nets from the surface, through the internal layers, and back to the surface, perhaps in a different area of the board, enabling more repairs than would otherwise be possible. This feature, which can clearly improve yields significantly, is crucial for prototype manufacture.

Quality improvement data generation

Even where repair is not an option, invaluable information regarding repetitive defects can be fed back to production as part of the quality and yield improvement process.